Patent Assignment
Reel/Frame 031005/0447
Assignment of Assignor's Interest
Recorded: 2013-08-14
Pages: 4
Assignors
MINAMI, HISATAKA
Executed: 2013-07-08
INOUE, KEISUKE
Executed: 2013-07-09
KIKKAWA, CHISATO
Executed: 2013-07-09
NOMURA, YUTAKA
Executed: 2013-07-18
IWANO, TOMOHIRO
Executed: 2013-07-08
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Cmp Polishing Fluid, Method for Manufacturing Same, Method for Manufacturing Composite Particle, and Method for Polishing Base Material
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →