IP Library Assignment 031062/0561
Patent Assignment
Reel/Frame 031062/0561

Assignment of Assignor's Interest

Recorded: 2013-08-22 Pages: 3
Assignors
FUNAOKA, DAIKI
Executed: 2013-08-16
SHIGA, KENJI
Executed: 2013-08-16
Assignee
TOYOBO CO., LTD.
2-8, DOJIMA HAMA 2-CHOME, KITA-KU, OSAKA-SHI, OSAKA, 5308230, JAPAN
Covered Property (1)
Resin Composition for Sealing Electrical Electronic Components, Method of Producing Electrical Electronic Component, and Sealed Electrical Electronic Component
Patent: 9,139,729 →
Application: 14/000,943 →
Publication: US 2013/0331521
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Aug 7, 2023
From: TOYOBO CO., LTD.
To: TOYOBO CO., LTD.
Reel/Frame 064505/0124 →
De-Merger Aug 7, 2023
From: TOYOBO CO., LTD.
To: TOYOBO MC CORPORATION
Reel/Frame 064505/0803 →