Resin composition for sealing electrical electronic components, method of producing electrical electronic component, and sealed electrical electronic component
It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.
1. A resin composition for sealing electrical electronic components, containing
a crystalline polyester-based elastomer (A),
a phenol-modified alkylbenzene resin (B1), and
a polyolefin resin (C),
and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.
2. The resin composition for sealing electrical electronic components according to claim 1 , wherein the crystalline polyester-based elastomer (A) is one resin or a mixture of 2 or more resins selected from the group consisting of a crystalline polyester resin (A1) being copolymerized with a polyether component, a crystalline polyester resin (A2) being copolymerized with a polycarbonate component, and a crystalline polyester resin (A3) being copolymerized with a polylactone component.
3. The resin composition according to claim 1 , wherein the phenol-modified alkylbenzene resin (B1) is an alkylphenol-modified alkylbenzene resin and has a hydroxyl value of 100 equivalent/10 6 g or more.
4. The resin composition according to claim 1 , wherein 0.1 to 100 parts by weight in total of the phenol-modified alkylbenzene resin (B1) and 0.1 to 100 parts by weight of the polyolefin resin (C) are blended with 100 parts by weight of the crystalline polyester-based elastomer (A).
5. The resin composition for sealing electrical electronic components according to claim 1 , having a T type peeling strength retention ratio of 50% or more after applying 1000 cycles of cooling and heating cycle at −40° C. for 30 minutes and at 80° C. for 30 minutes for an aluminum plate.
6. The resin composition for sealing electrical electronic components according to claim 1 , having an initial T type peeling strength of 0.5 N/mm or more for an aluminum plate.
7. A method for producing a sealed electrical electronic component by heating and kneading the resin composition according to claim 1 and thereafter injecting the resin composition into a mold including an inserted electrical electronic component at a resin composition temperature of 130° C. or higher and 260° C. or lower and at a resin composition pressure of 0.1 MPa or more and 10 MPa or less.
8. A sealed electrical electronic component sealed with the resin composition according to claim 1 .