Patent Assignment
Reel/Frame 031064/0189
Assignment of Assignor's Interest
Recorded: 2013-08-22
Pages: 7
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
High Density Interconnect Device and Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.