Patent Assignment
Reel/Frame 031069/0874
Assignment of Assignor's Interest
Recorded: 2013-08-23
Pages: 7
Assignors
HONG, JISUN
Executed: 2013-07-22
KIM, HYUNKI
Executed: 2013-07-22
SHIM, JONGBO
Executed: 2013-07-25
LEE, SEOKWON
Executed: 2013-07-22
CHOI, KYOUNGSEI
Executed: 2013-07-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same