Patent Assignment
Reel/Frame 031072/0172
Assignment of Assignor's Interest
Recorded: 2013-08-23
Pages: 5
Assignors
LEE, MIN GON
Executed: 2013-07-19
LEE, SEUNG HO
Executed: 2013-07-19
KIM, JONG HAN
Executed: 2013-07-19
LEE, YOON HEE
Executed: 2013-07-22
LEE, SUNG HWAN
Executed: 2013-07-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Ceramic Electronic Component and Mounting Board Therefor