Patent Assignment
Reel/Frame 031074/0529
Assignment of Assignor's Interest
Recorded: 2013-08-23
Pages: 4
Assignors
HUH, MYUNG-SOO
Executed: 2013-03-05
YI, JEONG-HO
Executed: 2013-03-06
LEE, YONG-SUK
Executed: 2013-03-06
Assignee
SAMSUNG DISPLAY CO., LTD.
95, SAMSUNG 2 RO, GIHEUNG-GU, YONGIN-CITY, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method for Manufacturing Thin Film Encapsulation