Patent Assignment
Reel/Frame 031077/0095
Assignment of Assignor's Interest
Recorded: 2013-08-26
Pages: 12
Assignors
YANG, CHING-LI
Executed: 2013-07-10
KUO, CHIEN-LI
Executed: 2013-07-10
CHIANG, CHUNG-SUNG
Executed: 2013-07-10
TSAI, YU-HAN
Executed: 2013-07-10
KANG, CHUN-WEI
Executed: 2013-07-10
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Structure Having Through Silicon via for Signal and Shielding Structure
Patent:
8,916,471 →
Application:
13/975,382 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.