Patent Assignment
Reel/Frame 031077/0814
Assignment of Assignor's Interest
Recorded: 2013-08-06
Pages: 4
Assignors
HABA, BELGACEM
Executed: 2010-06-01
DAMBERG, PHILIP
Executed: 2010-06-01
OSBORN, PHILIP R.
Executed: 2010-06-01
Assignee
TESSERA RESEARCH LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, USA 95134
Covered Property
(1)
Microelectronic Assembly with Joined Bond Elements Having Lowered Inductance
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 12, 2013
From: TESSERA RESEARCH LLC
To: TESSERA, INC.
Reel/Frame 031096/0919 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →