Patent Assignment
Reel/Frame 031096/0919
Assignment of Assignor's Interest
Recorded: 2013-08-12
Pages: 6
Assignor
TESSERA RESEARCH LLC
Executed: 2011-09-08
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Microelectronic Assembly with Joined Bond Elements Having Lowered Inductance
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 6, 2013
From: HABA, BELGACEM; DAMBERG, PHILIP; OSBORN, PHILIP R.
To: TESSERA RESEARCH LLC
Reel/Frame 031077/0814 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →