IP Library › Assignment 031089/0084
Patent Assignment
Reel/Frame 031089/0084

Assignment of Assignor's Interest

Recorded: 2013-08-27 Pages: 4
Assignor
NXP B.V.
Executed: 2013-04-11
Assignee
STMICROELECTRONICS (CROLLES 2) SAS
850, RUE JEAN MONNET, CROLLES CEDEX, 38920, FRANCE
Covered Property (1)
Method for Forming Metal Interconnects in a Dielectric Material
Patent: 8,138,082 →
Application: 12/280,978 →
Publication: US 2009/0218699
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 26, 2009
From: TORRES, JOAQUIN; ARNAL, VINCENT; GOSSET, LAURENT-GEORGES; BESLING, WIM
To: STMICROELECTRONICS (CROLLES 2) SAS; KONINKLJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 022454/0455 →
Assignment of Assignor's Interest Apr 28, 2009
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 022597/0832 →