Patent Assignment
Reel/Frame 031106/0237
Assignment of Assignor's Interest
Recorded: 2013-08-29
Pages: 8
Assignors
ISHIZAKA, TADAHIRO
Executed: 2013-08-12
GOMI, ATSUSHI
Executed: 2013-08-12
SUZUKI, KENJI
Executed: 2013-08-12
HATANO, TATSUO
Executed: 2013-08-12
TOSHIMA, HIROYUKI
Executed: 2013-08-12
MIZUSAWA, YASUSHI
Executed: 2013-08-12
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method for Forming Cu Wiring