Patent Assignment
Reel/Frame 031107/0450
Assignment of Assignor's Interest
Recorded: 2013-08-29
Pages: 4
Assignors
CHOU, CHUNG-CHENG
Executed: 2013-08-27
LEE, PO-HAO
Executed: 2013-08-27
CHEN, JONATHAN TEHAN
Executed: 2013-08-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Cooling System for 3D Ic