Patent Assignment
Reel/Frame 031108/0669
Assignment of Assignor's Interest
Recorded: 2013-08-29
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Integrated Circuit with a Sidewall Layer and an Ultra-Thick Metal Layer and Method of Making