Patent Assignment
Reel/Frame 031119/0666
Assignment of Assignor's Interest
Recorded: 2013-08-30
Pages: 2
Assignor
HSU, YING-YU
Executed: 2013-08-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Stacked Chip Layout Having Overlapped Active Circuit Blocks