Patent Assignment
Reel/Frame 031121/0309
Assignment of Assignor's Interest
Recorded: 2013-08-30
Pages: 3
Assignors
LIN, SHIH TING
Executed: 2013-08-19
YEH, KUNG-CHEN
Executed: 2013-08-19
LU, SZU WEI
Executed: 2013-08-19
LIN, JING-CHENG
Executed: 2013-08-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
3D Packages and Methods for Forming the Same