Patent Assignment
Reel/Frame 031129/0374
Assignment of Assignor's Interest
Recorded: 2013-09-03
Pages: 6
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method of Forming the Same