Patent Assignment
Reel/Frame 031129/0691
Assignment of Assignor's Interest
Recorded: 2013-09-03
Pages: 4
Assignors
YAO, LIANG-GI
Executed: 2013-08-27
OKUNO, YASUTOSHI
Executed: 2013-08-27
HU, WEI-SHAN
Executed: 2013-08-29
ONIKI, YUSUKE
Executed: 2013-08-27
YEH, LING-YEN
Executed: 2013-08-27
WANN, CLEMENT HSINGJEN
Executed: 2013-08-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Stress Analysis of 3-D Structures Using Tip-Enhanced Raman Scattering Technology