Patent Assignment
Reel/Frame 031129/0797
Assignment of Assignor's Interest
Recorded: 2013-09-03
Pages: 3
Assignors
CHEN, WEI-MING
Executed: 2013-08-28
HSIEH, CHENG-HSIEN
Executed: 2013-08-28
HUANG, SUNG-HUI
Executed: 2013-08-28
HSU, KUO-CHING
Executed: 2013-08-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Three-Dimensional Chip Stack and Method of Forming the Same