Patent Assignment
Reel/Frame 031132/0991
Assignment of Assignor's Interest
Recorded: 2013-09-02
Pages: 4
Assignors
CHIU, SAO-LING
Executed: 2013-07-30
HSU, KUO-CHING
Executed: 2013-07-30
WU, WEI-CHENG
Executed: 2013-08-01
HUANG, PING-KANG
Executed: 2013-08-01
HOU, SHANG-YUN
Executed: 2013-08-01
JENG, SHIN-PUU
Executed: 2013-08-01
YU, CHEN-HUA
Executed: 2013-08-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Packages with Interposers and Methods for Forming the Same