Patent Assignment
Reel/Frame 031135/0912
Assignment of Assignor's Interest
Recorded: 2013-09-04
Pages: 4
Assignors
LIN, JENG-SHYAN
Executed: 2013-08-28
YAUNG, DUN-NIAN
Executed: 2013-08-28
LIU, JEN-CHENG
Executed: 2013-08-28
HUNG, FENG-CHI
Executed: 2013-08-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO.8, LI-HSIN ROAD., 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Mechanisms for Forming Image-Sensor Device with Deep-Trench Isolation Structure