Patent Assignment
Reel/Frame 031151/0389
Assignment of Assignor's Interest
Recorded: 2013-09-06
Pages: 4
Assignors
TSENG, YUAN-TAI
Executed: 2013-09-02
LIU, MING-CHYI
Executed: 2013-09-02
CHOU, CHUNG-YEN
Executed: 2013-09-02
TSAI, CHIA-SHIUNG
Executed: 2013-09-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Thin Film Resistor Integrated between Interconnect Levels and Contacting an Underlying Dielectric Layer Protrusion