Patent Assignment
Reel/Frame 031165/0609
Assignment of Assignor's Interest
Recorded: 2013-09-09
Pages: 4
Assignors
TAIBI, RACHID
Executed: 2013-07-18
CHAPPAZ, CEDRICK
Executed: 2013-08-21
DI CIOCCIO, LEA
Executed: 2013-07-23
CHAPELON, LAURENT-LUC
Executed: 2013-07-23
Assignees
STMICROELECTRONICS SA
29, BOULEVARD ROMAIN ROLLAND, MONTROUGE, F-92120, FRANCE
STMICROELECTRONICS (CROLLES 2) SAS
850, RUE JEAN MONNET, CROLLES, 38926, FRANCE
Covered Property
(1)
Method for Estimating the Diffusion Length of Metallic Species Within a Three-Dimensional Integrated Structure, and Corresponding Three-Dimensional Integrated Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.