Patent Assignment
Reel/Frame 031168/0824
Assignment of Assignor's Interest
Recorded: 2013-09-09
Pages: 5
Assignors
CHEN, YU-HUA
Executed: 2013-08-09
LO, WEI-CHUNG
Executed: 2013-08-16
HU, DYI-CHUNG
Executed: 2013-08-13
HSIEH, CHANG-HONG
Executed: 2013-08-14
Assignees
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING ROAD, CHUTUNG TOWNSHIP, HSINCHU COUNTY, TAIWAN
UNIMICRON TECHNOLOGY CORPORATION
NO. 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property
(1)
Package Substrate Having Photo-Sensitive Dielectric Layer and Method of Fabricating the Same