IP Library › Assignment 031169/0588
Patent Assignment
Reel/Frame 031169/0588

Assignment of Assignor's Interest

Recorded: 2013-08-20 Pages: 2
Assignors
LEE, SANG-KYUNG
Executed: 2013-08-05
LEE, HEE-KYOUNG
Executed: 2013-08-05
LEE, DONG-HWAN
Executed: 2013-08-05
LIM, KYUNG-SANG
Executed: 2013-08-05
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
(MAETAN 3-DONG), 150 MAEYEONG-RO,, YEONGTONG-GU, SUWON-SI,, GYEONGGI-DO 443-743, KOREA, REPUBLIC OF
Covered Property (1)
Printed Circuit Board
Patent: 9,226,388 →
Application: 13/955,474 →
Publication: US 2014/0034357