Patent Assignment
Reel/Frame 031171/0368
Assignment of Assignor's Interest
Recorded: 2013-09-10
Pages: 2
Assignor
LEE, JAM-WEM
Executed: 2013-09-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Backside Contacts for Integrated Circuit Devices