Patent Assignment
Reel/Frame 031192/0358
Assignment of Assignor's Interest
Recorded: 2013-09-12
Pages: 3
Assignor
SCANLAN, CHRISTOPHER M.
Executed: 2013-05-08
Assignee
DECA TECHNOLOGIES, INC.
7855 SOUTH RIVER PARKWAY, SUITE 111, TEMPE, ARIZONA, 85284
Covered Property
(1)
Die Up Fully Molded Fan-Out Wafer Level Packaging
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.