Patent Assignment
Reel/Frame 055017/0342
Change of Name
Recorded: 2021-01-18
Pages: 7
Assignor
DECA TECHNOLOGIES INC.
Executed: 2020-12-22
Assignee
DECA TECHNOLOGIES USA, INC.
7855 SOUTH RIVER PARKWAY, STE. 205, TEMPE, ARIZONA, 85284
Covered Properties
(46)
Stackable Fully Molded Semiconductor Structure with Vertical Interconnects
PCT:
PCT/US2020/038440 ↗
Wafer Carrier Comprising a Variable Aperture Shield
Patent:
8,784,621 →
Application:
13/250,070 →
Fully Molded Fan-Out
Integrated Circuit Package Auto-Routing
Patent:
8,656,333 →
Application:
13/466,049 →
Magnetically Sealed Wafer Plating Jig System and Method
Die Up Fully Molded Fan-Out Wafer Level Packaging
Adaptive Patterning for Panelized Packaging
Semiconductor Device and Method of Adaptive Patterning for Panelized Packaging
Semiconductor Device and Method of Land Grid Array Packaging with Bussing Lines
Fully Molded Fan-Out
Adaptive Patterning for Panelized Packaging
Adaptive Patterning for Panelized Packaging
Adjustable Wafer Plating Shield and Method
Die Up Fully Molded Fan-Out Wafer Level Packaging
Two Step Method of Rapid Curing a Semiconductor Polymer Layer
Semiconductor Device and Method of Adaptive Patterning for Panelized Packaging with Dynamic via Clipping
Patent:
9,040,316 →
Application:
14/302,977 →
Die Up Fully Molded Fan-Out Wafer Level Packaging
Semiconductor Device and Method Comprising Thickened Redistribution Layers
Semiconductor Device and Method of Adaptive Patterning for Panelized Packaging with Dynamic via Clipping
Front Side Package-Level Serialization for Packages Comprising Unique Identifiers
Two Step Method of Rapid Curing a Semiconductor Polymer Layer
Semiconductor Device and Method Comprising Redistribution Layers
Semiconductor Device and Method of Adaptive Patterning for Panelized Packaging
Automated Optical Inspection of Unit Specific Patterning
Method of Marking a Semiconductor Package
3D Interconnect Component for Fully Molded Packages
Fully Molded Peripheral Package on Package Device
Semiconductor Device Processing Method for Material Removal
Semiconductor Device and Method of Adaptive Patterning for Panelized Packaging with Dynamic via Clipping
Thermally Enhanced Fully Molded Fan-Out Module
Multi-Die Package Comprising Unit Specific Alignment and Unit Specific Routing
Semiconductor Device and Method Comprising Redistribution Layers
Fully Molded Miniaturized Semiconductor Module
Fully Molded Peripheral Package on Package Device
Method of Marking a Semiconductor Package
Semiconductor Device Processing Method for Material Removal
Automated Optical Inspection of Unit Specific Patterning
Semiconductor Device and Method of Unit Specific Progressive Alignment
Fully Molded Miniaturized Semiconductor Module
Semiconductor Device and Method of Packaging
Thermally Enhanced Fully Molded Fan-Out Module
Method of Making Fully Molded Peripheral Package on Package Device
Semiconductor Device and Method of Unit Specific Progressive Alignment
Fully Molded Semiconductor Package for Power Devices and Method of Making the Same
Stackable Fully Molded Semiconductor Structure with Vertical Interconnects
Fully Molded Semiconductor Structure with Face Mounted Passives and Method of Making the Same
Application:
63/119,923 →
Related Assignments
(24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 30, 2011
From: SCANLAN, CHRISTOPHER M
To: DECA TECHNOLOGIES, INC.
Reel/Frame 027466/0713 →
Assignment of Assignor's Interest
Feb 6, 2012
From: DOMINGO, RICO STO.
To: DECA TECHNOLOGIES INC.
Reel/Frame 027660/0290 →
Assignment of Assignor's Interest
Feb 6, 2012
From: DOMINGO, RICO STO.
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 027655/0788 →
Assignment of Assignor's Interest
May 7, 2012
From: BISHOP, CRAIG; SCANLAN, CHRISTOPHER M; OLSON, TIM
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 028168/0586 →
Corrective Assignment to Correct the Assignee Previously Recorded on Reel 028168 Frame 0586. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
May 11, 2012
From: BISHOP, CRAIG; SCANLAN, CHRISTOPHER M; OLSON, TIM
To: DECA TECHNOLOGIES, INC.
Reel/Frame 028193/0692 →
Assignment of Assignor's Interest
Feb 25, 2013
From: OLSON, TIMOTHY L.; SCANLAN, CHRISTOPHER M.
To: DECA TECHNOLOGIES INC
Reel/Frame 029866/0131 →
Assignment of Assignor's Interest
Apr 23, 2013
From: SCANLAN, CHRISTOPHER M.; ALDAS, FERDINAND; BLAISDELL, KENNETH; ABANES, CHERYL R.
To: DECA TECHNOLOGIES INC.
Reel/Frame 030270/0145 →
Assignment of Assignor's Interest
May 9, 2013
From: SCANLAN, CHRISTOPHER M.
To: DECA TECHNOLOGIES, INC.
Reel/Frame 030388/0752 →
Assignment of Assignor's Interest
May 9, 2013
From: SCANLAN, CHRISTOPHER M.; OLSON, TIMOTHY L.
To: DECA TECHNOLOGIES INC.
Reel/Frame 030388/0599 →
Assignment of Assignor's Interest
May 10, 2013
From: SCANLAN, CHRISTOPHER M.; OLSON, TIMOTHY L.
To: DECA TECHNOLOGIES INC.
Reel/Frame 030395/0870 →
Assignment of Assignor's Interest
May 13, 2013
From: SCANLAN, CHRISTOPHER M.; OLSON, TIMOTHY L.
To: DECA TECHNOLOGIES INC
Reel/Frame 030406/0035 →
Assignment of Assignor's Interest
May 14, 2013
From: SCANLAN, CHRISTOPHER M.
To: DECA TECHNOLOGIES INC.
Reel/Frame 030411/0832 →
Assignment of Assignor's Interest
May 16, 2013
From: STO. DOMINGO, RICO
To: DECA TECHNOLOGIES INC
Reel/Frame 030432/0055 →
Assignment of Assignor's Interest
Jun 10, 2013
From: SCANLAN, CHRISTOPHER M.; OLSON, TIMOTHY L.
To: DECA TECHNOLOGIES INC.
Reel/Frame 030581/0859 →
Assignment of Assignor's Interest
Sep 12, 2013
From: SCANLAN, CHRISTOPHER M.
To: DECA TECHNOLOGIES, INC.
Reel/Frame 031192/0358 →
Assignment of Assignor's Interest
Sep 24, 2013
From: ROGERS, WILLIAM BOYD; VAN DEN HOEK, WILLIBRORDUS GERARDUS MARIA
To: DECA TECHNOLOGIES INC.
Reel/Frame 031268/0272 →
Assignment of Assignor's Interest
Mar 12, 2014
From: STO. DOMINGO, RICO
To: DECA TECHNOLOGIES INC.
Reel/Frame 032415/0480 →
Assignment of Assignor's Interest
Mar 12, 2015
From: SCANLAN, CHRISTOPHER M; BISHOP, CRAIG
To: DECA TECHNOLOGIES INC.
Reel/Frame 035148/0726 →
Assignment of Assignor's Interest
Jun 16, 2015
From: SCANLAN, CHRISTOPHER M.; BISHOP, CRAIG
To: DECA TECHNOLOGIES INC.
Reel/Frame 035847/0440 →
Assignment of Assignor's Interest
Jan 20, 2016
From: SCANLAN, CHRISTOPHER M; BISHOP, CRAIG
To: DECA TECHNOLOGIES INC.
Reel/Frame 037529/0351 →
Assignment of Assignor's Interest
Jan 26, 2016
From: SCANLAN, CHRISTOPHER M.
To: DECA TECHNOLOGIES INC.
Reel/Frame 037588/0372 →
Assignment of Assignor's Interest
Apr 21, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: DECA TECHNOLOGIES INC.
Reel/Frame 038346/0179 →
Assignment of Assignor's Interest
Dec 27, 2021
From: DECA TECHNOLOGIES USA, INC.
To: SEMSYSCO GMBH
Reel/Frame 058479/0846 →
Change of Name
Mar 11, 2026
From: SEMSYSCO GMBH
To: LAM RESEARCH SALZBURG GMBH
Reel/Frame 075091/0218 →