Adjustable wafer plating shield and method
A wafer carrier is described. In one embodiment, the wafer carrier includes a variable aperture shield. The wafer carrier may include an electrically conductive wafer plating jig base having a plurality of concentric overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size, a plurality of concentric magnetic attractors, at least one positioned within each of the plurality of overlapping cavities, and a cover plate comprising an open center surrounded by a support, the cover plate comprising an attractive material positioned within the support adjacent to the open center and aligned with at least one of the magnetic attractors when the cover plate is positioned over the wafer plating jig base.
1. An apparatus comprising:
a plating tank;
a wafer plating jig configured to hold a semiconductor wafer and to be disposed at least partially within the plating tank and;
a variable aperture shield, wherein the wafer carrier is mounted to a side of the plating tank and configured to be disposed adjacent the wafer plating jig, wherein the variable aperture shield further comprises:
a cover plate,
a plurality of fins coupled to the cover plate wherein the plurality of fins form a variable aperture and at least one of the plurality of fins coupled to the cover plate is configured to move towards or away from a center of the variable aperture to change a diameter of the variable aperture, and
a handle coupled to the cover plate.
2. The apparatus of claim 1 , wherein the variable aperture shield is disposed at least partially within the plating tank and the handle is configured to be disposed above a plating solution.
3. The apparatus of claim 1 , wherein a size of an aperture of the variable aperture shield is adjustable while the variable aperture shield is disposed at least partially within the plating tank.
4. The apparatus of claim 1 , wherein the movement comprises a rotation of at least one of the plurality of the fins.
5. The apparatus of claim 4 , wherein the rotation of the at least one of the plurality of fins comprises a simultaneous rotation of the plurality of fins and of the handle.
6. The apparatus of claim 4 , wherein at least one of the plurality of the fins overlaps a fin adjacent to the at least one of the plurality of the fins upon the rotation.
7. The apparatus of claim 1 , wherein the movement of the plurality of fins comprises a convergence of the plurality of fins towards the center of the variable aperture.
8. The apparatus of claim 1 , wherein each of the plurality of fins comprises a pivot point configured to move the fin with respect to the cover plate.
9. The apparatus of claim 1 , wherein each of the plurality of fins comprises a lever point configured to move the fin towards or away from the center of the variable aperture.
10. The apparatus of claim 9 , wherein the handle of the cover plate is configured to move the lever points of the plurality of fins.
11. The apparatus of claim 1 , wherein the variable aperture shield is separate from the wafer plating jig.
12. The apparatus of claim 1 , wherein the wafer plating jig comprises a plurality of concentric overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size.
13. An apparatus comprising:
a plating tank; and
a variable aperture shield mounted to the plating tank and configured to be disposed adjacent a semiconductor wafer to be plated, wherein the variable aperture shield further comprises:
a cover plate,
a plurality of fins coupled to the cover plate wherein the plurality of fins form a variable aperture and at least one of the plurality of fins coupled to the cover plate is configured to move towards or away from a center of the variable aperture to change a diameter of the variable aperture, and
a handle coupled to the cover plate.
14. The apparatus of claim 13 , wherein the variable aperture shield is disposed at least partially within the plating tank and the handle is configured to be disposed above a plating solution.
15. The apparatus of claim 13 , wherein a size of an aperture of the variable aperture shield is adjustable while the variable aperture shield is disposed at least partially within the plating tank.
16. The apparatus of claim 13 , wherein the movement of the plurality of fins comprises a convergence of the plurality of fins towards the center of the variable aperture.
17. The apparatus of claim 13 , wherein each of the plurality of fins comprises a pivot point configured to move the fin with respect to the cover plate.
18. The apparatus of claim 13 , wherein each of the plurality of fins comprises a lever point configured to move the fin towards or away from the center of the variable aperture.
19. The apparatus of claim 18 , wherein the handle of the cover plate is configured to move the lever points of the plurality of fins.
20. The apparatus of claim 13 , further comprising a wafer plating jig separate from the variable aperture shield, the wafer plating jig configured to hold the semiconductor wafer and to be disposed at least partially within the plating tank adjacent the variable aperture shield.
21. An apparatus comprising:
a plating tank; and
a variable aperture shield mounted to the plating tank and configured to be disposed adjacent a semiconductor wafer to be plated wherein a size of an aperture of the variable aperture shield is adjustable while the variable aperture shield is disposed at least partially within the plating tank
wherein the variable aperture shield comprises a plurality of fins that form a variable aperture and at least one of the plurality of fins coupled to a cover plate is configured to rotatably move towards or away from a center of the variable aperture to change a diameter of the variable aperture.
22. The apparatus of claim 21 , further comprising a handle formed as part of the variable aperture shield, wherein the variable aperture shield is disposed at least partially within the plating tank.
23. The apparatus of claim 22 , wherein the handle is configured to be disposed above a plating solution contained within the plating tank.
24. The apparatus of claim 21 , wherein the movement of the plurality of fins comprises a convergence of the plurality of fins towards the center of the variable aperture.
25. The apparatus of claim 21 , wherein each of the plurality of fins comprises a pivot point configured to move the fin with respect to the cover plate.
26. The apparatus of claim 21 , wherein each of the plurality of fins comprises a lever point configured to move the fin towards or away from the center of the variable aperture.
27. The apparatus of claim 26 , wherein the variable aperture shield comprises a cover plate comprising a handle that is configured to move the lever points of the plurality of fins.
28. The apparatus of claim 21 , further comprising a wafer plating jig separate from the variable aperture shield, the wafer plating jig configured to hold the semiconductor wafer and to be disposed at least partially within the plating tank adjacent the variable aperture shield.