Patent Assignment
Reel/Frame 031205/0726
Assignment of Assignor's Interest
Recorded: 2013-09-13
Pages: 3
Assignors
TSAI, PO-HAO
Executed: 2013-09-06
CHENG, LI-HUI
Executed: 2013-09-06
HUNG, JUI-PIN
Executed: 2013-09-06
LIN, JING-CHENG
Executed: 2013-09-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Integrated Fan-Out Package Structures with Recesses in Molding Compound