Patent Assignment
Reel/Frame 031208/0067
Assignment of Assignor's Interest
Recorded: 2013-09-15
Pages: 5
Assignors
HABLE, WOLFRAM
Executed: 2013-05-10
GRASSMANN, ANDREAS
Executed: 2013-05-13
WINTER, FRANK
Executed: 2013-05-14
GEITNER, OTTMAR
Executed: 2013-05-13
SCHWARZ, ALEXANDER
Executed: 2013-05-14
HERBRANDT, ALEXANDER
Executed: 2013-05-15
KOENIG, LOTHAR
Executed: 2013-05-13
UHLEMANN, ANDRE
Executed: 2013-05-14
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Power Module with Cooling Structure on Bonding Substrate for Cooling an Attached Semiconductor Chip