Patent Assignment
Reel/Frame 031214/0048
Assignment of Assignor's Interest
Recorded: 2013-09-16
Pages: 3
Assignor
HU, CHUAN
Executed: 2012-01-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Dense Interconnect with Solder Cap (Disc) Formation with Laser Ablation and Resulting Semiconductor Structures and Packages