Patent Assignment
Reel/Frame 031222/0556
Assignment of Assignor's Interest
Recorded: 2013-09-17
Pages: 6
Assignors
HWANG, HEEDON
Executed: 2013-09-02
KIM, JUEUN
Executed: 2013-09-02
NAM, KIHONG
Executed: 2013-09-02
KIM, BONGHYUN
Executed: 2013-09-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same