Patent Assignment
Reel/Frame 031242/0014
Assignment of Assignor's Interest
Recorded: 2013-09-19
Pages: 4
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Method for Manufacturing Wiring Substrate