Patent Assignment
Reel/Frame 031264/0470
Assignment of Assignor's Interest
Recorded: 2013-09-24
Pages: 5
Assignors
HABLE, WOLFRAM
Executed: 2013-09-18
GRASSMANN, ANDREAS
Executed: 2013-09-18
WINTER, FRANK
Executed: 2013-09-23
GEITNER, OTTMAR
Executed: 2013-09-18
SCHWARZ, ALEXANDER
Executed: 2013-09-16
HERBRANDT, ALEXANDER
Executed: 2013-09-16
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Substrate, Chip Arrangement, and Method for Manufacturing the Same