Patent Assignment
Reel/Frame 031266/0770
Assignment of Assignor's Interest
Recorded: 2013-09-10
Pages: 8
Assignors
HABA, BELGACEM
Executed: 2008-09-15
HUMPSTON, GILES
Executed: 2008-10-20
MARGALIT, MOTI
Executed: 2008-10-28
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, USA 95134
Covered Property
(1)
Semiconductor Packaging Process Using Through Silicon Vias
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 11, 2013
From: TESSERA, INC.
To: TESSERA TECHNOLOGIES IRELAND LIMITED
Reel/Frame 031264/0419 →
Change of Name
Sep 12, 2013
From: TESSERA TECHNOLOGIES IRELAND LIMITED
To: DIGITALOPTICS CORPORATION EUROPE LIMITED
Reel/Frame 031323/0555 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →