Patent Assignment
Reel/Frame 031285/0522
Assignment of Assignor's Interest
Recorded: 2013-09-26
Pages: 3
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3F, 157 LI-TE RD., PEITOU DISTRICT, TAIPEI CITY, 11259, TAIWAN
Covered Property
(1)
Three Dimensional Semiconductor Assembly Board with Bump/Flange Supporting Board, Coreless Build-Up Circuitry and Built-in Electronic Device