IP Library Assignment 031306/0798
Patent Assignment
Reel/Frame 031306/0798

Assignment of Assignor's Interest

Recorded: 2013-09-30 Pages: 2
Assignor
TAKIZAWA, DAISUKE
Executed: 2013-08-06
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property (1)
Wiring Substrate
Patent: 9,049,799 →
Application: 14/021,189 →
Publication: US 2014/0085847