Patent Assignment
Reel/Frame 031317/0648
Assignment of Assignor's Interest
Recorded: 2013-10-01
Pages: 2
Assignors
KATAYAMA, HIROYUKI
Executed: 2013-08-19
KONDO, TAKASHI
Executed: 2013-08-20
EBE, YUKI
Executed: 2013-08-20
MITANI, MUNEHISA
Executed: 2013-08-20
Assignee
NITTO DENKO CORPORATION
1-2, SHIMO-HOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Encapsulating Sheet-Covered Semiconductor Element, Producing Method Thereof, Semiconductor Device, and Producing Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.