Encapsulating sheet-covered semiconductor element and semiconductor device
View Patent ↗An encapsulating sheet-covered semiconductor element includes a semiconductor element having one surface in contact with a board and the other surface disposed at the other side of the one surface and an encapsulating sheet covering at least the other surface of the semiconductor element. The encapsulating sheet includes an exposed surface that is, when projected from one side toward the other side, not included in the one surface of the semiconductor element and exposed from the one surface and the exposed surface has the other side portion that is positioned toward the other side with respect to the one surface of the semiconductor element.
1. An encapsulating sheet-covered semiconductor element comprising:
a semiconductor element and an encapsulating sheet,
wherein the semiconductor element has a first surface for being brought into contact with a board and a second surface,
wherein the encapsulating sheet has a first surface and a second surface, the first surface of the encapsulating sheet being in direct contact with at least the second surface of the semiconductor element, and
wherein the first surface of the encapsulating sheet includes an exposed surface,
the exposed surface having a portion that is positioned toward the second surface with respect to the first surface of the semiconductor element.
2. The encapsulating sheet-covered semiconductor element according to claim 1 , wherein the entire exposed surface is all of the portion.
3. The encapsulating sheet-covered semiconductor element according to claim 1 , wherein the semiconductor element is an optical semiconductor element including a luminous layer.
4. The encapsulating sheet-covered semiconductor element according to claim 3 , wherein the luminous layer forms at least the second surface of the optical semiconductor element.
5. The encapsulating sheet-covered semiconductor element according to claim 3 , wherein the optical semiconductor element is an LED.
6. The encapsulating sheet-covered semiconductor element according to claim 1 , wherein the encapsulating sheet is a phosphor sheet containing a phosphor.
7. The encapsulating sheet-covered semiconductor element according to claim 1 , wherein a plurality of the semiconductor elements are provided at spaced intervals to each other.
8. The encapsulating sheet-covered semiconductor element according to claim 1 , wherein
the semiconductor element includes a semiconductor layer, and an electrode portion having an anode electrode and a cathode electrode,
the anode electrode and the cathode electrode both being disposed only on the first surface side with respect to the semiconductor layer.
9. The encapsulating sheet-covered semiconductor element according to claim 1 , wherein the encapsulating sheet is formed from a resin composition containing a silicone resin composition.
10. A semiconductor device comprising:
a board, and
an encapsulating sheet-covered semiconductor element including a semiconductor element and an encapsulating sheet, the semiconductor element having a first surface in contact with the board and a second-surface disposed and
the encapsulating sheet including a first surface and a second surface, the first surface of the encapsulating sheet being in direct contact with at least the second surface of the semiconductor element,
the first surface of the encapsulating sheet including an exposed surface,
the exposed surface having a portion that is positioned toward the second surface with respect to the first surface of the semiconductor element.