IP Library Assignment 031330/0821
Patent Assignment
Reel/Frame 031330/0821

Assignment of Assignor's Interest

Recorded: 2013-10-02 Pages: 7
Assignors
HIROSE, YOSHIRO
Executed: 2013-08-29
SANO, ATSUSHI
Executed: 2013-08-29
OKUDA, KAZUYUKI
Executed: 2013-08-29
MAEDA, KIYOHIKO
Executed: 2013-08-29
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME,, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Method of Manufacturing Semiconductor Device and Method of Processing Substrate and Substrate Processing Apparatus
Patent: 9,349,587 →
Application: 14/044,358 →
Publication: US 2014/0038429
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →