Patent Assignment
Reel/Frame 031342/0390
Assignment of Assignor's Interest
Recorded: 2013-10-03
Pages: 8
Assignors
KIM, KEUN-NAM
Executed: 2013-06-18
PARK, SUN-YOUNG
Executed: 2013-06-18
SHIN, SOO-HO
Executed: 2013-06-18
YEOM, KYE-HEE
Executed: 2013-06-18
JANG, HYEON-WOO
Executed: 2013-06-18
JEONG, JIN-WON
Executed: 2013-06-18
CHO, CHANG-HYUN
Executed: 2013-06-18
HONG, HYEONG-SUN
Executed: 2013-06-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Contact Pads