Patent Assignment
Reel/Frame 031342/0816
Assignment of Assignor's Interest
Recorded: 2013-10-03
Pages: 4
Assignors
CHEAH, BOK ENG
Executed: 2013-09-27
PERIAMAN, SHANGGAR
Executed: 2013-09-27
OOI, KOOI CHI
Executed: 2013-09-27
KONG, JACKSON CHUNG PENG
Executed: 2013-09-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method to Enable Controlled Side Chip Interconnection for 3D Integrated Packaging System