IP Library Assignment 031350/0119
Patent Assignment
Reel/Frame 031350/0119

Assignment of Assignor's Interest

Recorded: 2013-10-04 Pages: 8
Assignors
KANAI, AKINOBU
Executed: 2013-09-19
ADACHI, YOSHITAKA
Executed: 2013-09-24
SHIMIZU, MASAO
Executed: 2013-09-13
TANAKA, JUNICHI
Executed: 2013-09-24
SASAKI, SHO
Executed: 2013-09-13
Assignee
OMRON CORPORATION
801, MINAMIFUDODO-CHO; HORIKAWAHIGASHIIRU, SHIOKOJI-DORI, SHIMOGYO-KU;, KYOTO-SHI, KYOTO, 600-8530, JAPAN
Covered Property (1)
Sensor Package
Patent: 8,969,981 →
Application: 14/003,343 →
Publication: US 2014/0021565
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
De-Merger May 20, 2022
From: OMRON CORPORATION
To: SHIGA SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0451 →
Change of Name and Address May 20, 2022
From: SHIGA SEMICONDUCTOR CO., LTD.
To: MMI SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0466 →