IP Library › Assignment 031362/0170
Patent Assignment
Reel/Frame 031362/0170

Assignment of Assignor's Interest

Recorded: 2013-10-08 Pages: 4
Assignors
PLACH, THOMAS
Executed: 2013-09-27
HINGERL, KURT
Executed: 2013-09-30
WIMPLINGER, MARKUS
Executed: 2013-09-27
FLOTGEN, CHRISTOPH
Executed: 2013-10-08
Assignee
EV GROUP E. THALLNER GMBH
1, D1 ERICH THALLNER STRASSE, ST. FLORIAN AM INN, AT-4782, AUSTRIA
Covered Property (1)
Method for Permanently Bonding Wafers
Patent: 8,975,158 →
Application: 14/110,220 →
Publication: US 2014/0073112