Patent Assignment
Reel/Frame 031373/0366
Assignment of Assignor's Interest
Recorded: 2013-10-09
Pages: 4
Assignors
CHEN, MENG-TSE
Executed: 2013-08-21
LIN, HSIU-JEN
Executed: 2013-08-21
LIN, CHIH-WEI
Executed: 2013-08-21
CHENG, MING-DA
Executed: 2013-08-21
TUNG, CHIH-HANG
Executed: 2013-08-29
LIU, CHUNG-SHI
Executed: 2013-08-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Interconnect Structure