Patent Assignment
Reel/Frame 031375/0114
Assignment of Assignor's Interest
Recorded: 2013-10-09
Pages: 3
Assignors
JANG, BOR-PING
Executed: 2013-09-26
HWANG, CHIEN LING
Executed: 2013-09-26
LIAO, HSIN-HUNG
Executed: 2013-09-26
LIN, YEONG-JYH
Executed: 2013-09-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Wafer Device