Patent Assignment
Reel/Frame 031379/0459
Assignment of Assignor's Interest
Recorded: 2013-10-10
Pages: 3
Assignors
TANAKA, KOICHI
Executed: 2013-05-29
KURASHIMA, NOBUYUKI
Executed: 2013-05-30
IIZUKA, HAJIME
Executed: 2013-05-29
KOYAMA, TETSUYA
Executed: 2013-05-31
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Electronic Component Incorporated Substrate and Method for Manufacturing Electronic Component Incorporated Substrate