IP Library › Assignment 031381/0261
Patent Assignment
Reel/Frame 031381/0261

Assignment of Assignor's Interest

Recorded: 2013-10-10 Pages: 4
Assignors
HOU, LIPING DANIEL
Executed: 2013-04-10
LIAN, CHUANXIN
Executed: 2013-04-09
Assignee
GLOBAL COMMUNICATION SEMICONDUCTORS, LLC
23155 KASHIWA COURT, TORRANCE, CALIFORNIA, 90505
Covered Property (1)
Methods for Fabricating a Metal Structure for a Semiconductor Device
Patent: 9,865,690 →
Application: 13/852,346 →
Publication: US 2013/0267085
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 10, 2013
From: GLOBAL COMMUNICATION SEMICONDUCTORS, LLC
To: RF MICRO DEVICES, INC.
Reel/Frame 031381/0484 →
Merger Jun 16, 2016
From: RF MICRO DEVICES, INC.
To: QORVO US, INC.
Reel/Frame 039196/0941 →