Patent Assignment
Reel/Frame 031406/0117
Assignment of Assignor's Interest
Recorded: 2013-10-15
Pages: 3
Assignor
ZHANG, LEILEI
Executed: 2013-10-14
Assignee
NVIDIA CORPORATION
2701 SAN TOMAS EXPRESSWAY, SANTA CLARA, CALIFORNIA, 95050
Covered Property
(1)
Microelectronic Package with Stress-Tolerant Solder Bump Pattern